offline AOI EKT-VT-880
PCB Application | Application process | After stencil printing, after/before hot air reflow Can test both sides and multiple PCBs simultaneously |
PCB dimension | 20×20mm-450×350mm | |
PCB thickness | 0.3-5.0mm | |
PCB space | top:≤30mm;bottom:≤45mm | |
Inspection items | After stencil printing | Solder paste unavailability, insufficient or excessive solder paste, solder paste misalignment, solder paste bridging, stain , scratch and so on. |
Before or after reflow soldering | Missing or excessive component, misalignment, uneven, edging defect, opposite mounting , wrong polarity, wrong or bad components. | |
Before or after DIP wave soldering | Excessive or missing component, empty soldering, solder balls, solder misalignment, edging defect, bridging, IC NG, copper stain etc. | |
Visual system | Image system | CCD camera, German Basler 500 million px |
Lighting system | Three-channel white led light source or RGB light source | |
Resolution ratio | 18um(FOV dimension:28.8 mm×21.6 mm) | |
Inspection mode | Color calculation, color extraction, gray-scale operations, image matching, etc | |
Mechanical system | X/Y driving system | AC servo motor, Precision grinding ball screw |
PCB fixing mode | Auto fixture | |
Positioning accuracy | <8 um | |
Moving speed | 800mm/s(MAX) | |
Orbital adjustment | Manual | |
Software system | Computing system | Windows XP, ram 16GB |
Interface language | Chinese/English optional | |
Inspection output | PCB ID, PCB description, component description,defect description, defect image | |
Power | AC220±10%,50/60HZ,1KW | |
Operation temperature | -10-40℃ | |
Operation humidity | 20-90%RH non condensing | |
Machine dimension | 900×1100×1300mm |